采用串并联混合连接的10kV/200A SiC MOSFET模块

Q. Xiao, Zezheng Dong, Xinke Wu, Kuang Sheng
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引用次数: 3

摘要

本文提出并分析了一种串并联混合拓扑的高压SiC MOSFET模块。该模块由两个均匀并联的部分组成,每个部分由三个串联的子部分组成。子部件包含三个以字符串连接的主要部件,其中每个部件都有两个SiC mosfet的并联。这些SiC mosfet分为六个子模块,由一个共同的驱动信号驱动。基于这种混合拓扑结构,使用36个1200V/40A SiC MOSFET芯片制造了10kV/200A SiC MOSFET模块。测试和分析了该模块在5400V/200A电压下的动态开关性能,开关速度分别为440ns和250ns。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 10kV/200A SiC MOSFET module with series-parallel hybrid connection
In this paper, a high voltage SiC MOSFET module with series-parallel hybrid topology is presented and analyzed. The module consists of two uniform parts in parallel and each of the part includes three sub-parts in series. The sub-part contains three primary parts connected in string where each of these parts has a parallel of two SiC MOSFETs. These SiC MOSFETs are divided into six sub-modules, which are driven by a common driving signal. A 10kV/200A SiC MOSFETs module is fabricated based on this hybrid topology with thirty-six 1200V/40A SiC MOSFET chips. The dynamic switching behavior of the module is tested and analyzed at 5400V/200A with a switching speed of 440ns in turn-on process and 250ns in turn-off process.
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