超过40 gb /s的IC模块技术，采用8mm平方的无引线芯片载体封装，安装在四层树脂印刷电路板上

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) Pub Date : 1900-01-01 DOI:10.1109/GAAS.2001.964389

H. Sugahara, S. Kimura, K. Murata, E. Sano

{"title":"超过40 gb /s的IC模块技术，采用8mm平方的无引线芯片载体封装，安装在四层树脂印刷电路板上","authors":"H. Sugahara, S. Kimura, K. Murata, E. Sano","doi":"10.1109/GAAS.2001.964389","DOIUrl":null,"url":null,"abstract":"A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.","PeriodicalId":269944,"journal":{"name":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards\",\"authors\":\"H. Sugahara, S. Kimura, K. Murata, E. Sano\",\"doi\":\"10.1109/GAAS.2001.964389\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.\",\"PeriodicalId\":269944,\"journal\":{\"name\":\"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/GAAS.2001.964389\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.2001.964389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

为实现40gb /s以上光通信系统的小型、低成本集成电路模块，研究了一种关键技术。该技术主要采用8mm平方的无引线芯片载体(LCC)封装和四层树脂印刷电路板(pcb)。它被用于构建一个工作速度为45 Gb/s的多芯片1:4 DEMUX原型模块。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards

A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)

自引率

0.00%

发文量