超过40 gb /s的IC模块技术，采用8mm平方的无引线芯片载体封装，安装在四层树脂印刷电路板上

GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191) Pub Date : 1900-01-01 DOI:10.1109/GAAS.2001.964389

H. Sugahara, S. Kimura, K. Murata, E. Sano

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引用次数: 1

摘要

为实现40gb /s以上光通信系统的小型、低成本集成电路模块，研究了一种关键技术。该技术主要采用8mm平方的无引线芯片载体(LCC)封装和四层树脂印刷电路板(pcb)。它被用于构建一个工作速度为45 Gb/s的多芯片1:4 DEMUX原型模块。

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Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards

A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.

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GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)

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