基于inp的hemt器件技术及其在集成电路中的应用

T. Enoki, Takashi Kobayashi, Y. Ishii
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引用次数: 44

摘要

本文报道了我们实验室为超高速集成电路开发的0.1-/spl μ /m栅极inp -based hemt的器件技术。关键的发展包括非合金欧姆接触和t形栅极工艺,以实现高再现性和均匀性。作为它们在集成电路中的应用示例,描述了NF为2.6 dB的50 GHz低噪声放大器和平坦增益为9 dB的60 GHz带宽分布式基带放大器。还讨论了使用凹槽蚀刻塞,以进一步提高栅极凹槽的再现性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Device technologies for InP-based HEMTs and their application to ICs
This paper reports device technologies for 0.1-/spl mu/m-gate-InP-based HEMTs developed at our laboratory for ultra-high speed ICs. Key developments include a non-alloyed ohmic contact and a T-shaped gate process for high reproducibility and uniformity. As examples of their application to ICs, a 50 GHz low-noise amplifier with NF of 2.6 dB and a 60-GHz bandwidth distributed baseband amplifier with a flat gain of 9 dB are described. Also discussed is the use of a recess-etch stopper to further improve the reproducibility of the gate recess.
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