{"title":"直流应力下环氧绝缘的大量充装","authors":"C. W. Mangelsdorf, C. Cooke","doi":"10.1109/ICEI.1980.7470896","DOIUrl":null,"url":null,"abstract":"Stress enhancement due to the migration of charges can be a critical factor in the design of solid insulation for high voltage DC systems. The effect of bulk currents on surface and internal charge accumulation is discussed; and equations are formulated which predict steady-state conditions in arbitrary configurations o Experimental evidence is given for the validity of this analysis in epoxy insulators.","PeriodicalId":113059,"journal":{"name":"1980 IEEE International Conference on Electrical Insulation","volume":"44 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1980-06-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"55","resultStr":"{\"title\":\"Bulk charging of epoxy insulation under DC stress\",\"authors\":\"C. W. Mangelsdorf, C. Cooke\",\"doi\":\"10.1109/ICEI.1980.7470896\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Stress enhancement due to the migration of charges can be a critical factor in the design of solid insulation for high voltage DC systems. The effect of bulk currents on surface and internal charge accumulation is discussed; and equations are formulated which predict steady-state conditions in arbitrary configurations o Experimental evidence is given for the validity of this analysis in epoxy insulators.\",\"PeriodicalId\":113059,\"journal\":{\"name\":\"1980 IEEE International Conference on Electrical Insulation\",\"volume\":\"44 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1980-06-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"55\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1980 IEEE International Conference on Electrical Insulation\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICEI.1980.7470896\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1980 IEEE International Conference on Electrical Insulation","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEI.1980.7470896","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Stress enhancement due to the migration of charges can be a critical factor in the design of solid insulation for high voltage DC systems. The effect of bulk currents on surface and internal charge accumulation is discussed; and equations are formulated which predict steady-state conditions in arbitrary configurations o Experimental evidence is given for the validity of this analysis in epoxy insulators.
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