22nm FD-SOI的28GHz双向电流组合堆叠fet功率放大器

Zhiwei Zong, Xin-yan Tang, Johan Nguyen, K. Khalaf, G. Mangraviti, Yao-Hong Liu, P. Wambacq
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引用次数: 2

摘要

提出了一种用于28GHz无线通信的双向电流组合功率放大器(PA)。为了提高饱和输出功率(PSAT)和保持较高的功率附加效率(PAE),差分三叠晶体管结构被用于单元PA电池。采用容性中和和并联电感中间节点匹配的方法,提高了系统的稳定系数和PAE。通过合理设计偏置和栅极电容,可以缓解2.4V供电电压下的可靠性问题。该放大器采用22nm FD-SOI技术实现,芯片核心面积为0.21 mm2,测量结果表明,该放大器在28GHz时的功率增益为27dB, PSAT为21.7dBm,最大PAE为27.1%。输出1dB压缩点(P1aB)为19.1 dBm。P1dB和6dB功率回退时的实测PAE分别为23%和10.3%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A 28GHz Two-Way Current Combining Stacked-FET Power Amplifier in 22nm FD-SOI
We present a two-way current combining power amplifier (PA) for 28GHz wireless communication. To boost the saturated output power (PSAT) and maintain a high power-added efficiency (PAE), a differential 3-stacked transistors structure is used for the unit PA cell. The stability factor and the PAE are improved with capacitive neutralization and shunt inductor intermediate node matching. Reliability issues under a 2.4V supply voltage are relieved with properly designed biasing and gate capacitances. The PA is implemented in a 22nm FD-SOI technology with a chip core area of 0.21 mm2, Measurement results show that the PA achieves a power gain of 27dB and a PSAT of 21.7dBm with a maximum PAE of 27.1% at 28GHz. The output 1dB compression point (P1aB) is 19.1 dBm. Measured PAE at P1dB and 6dB power back-off are 23% and 10.3%, respectively.
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