采用倒装互连技术的高速(>100 Gbit/s) EADFB激光模块

2016 IEEE Photonics Conference (IPC) Pub Date : 2016-10-01 DOI:10.1109/IPCON.2016.7831049

S. Kanazawa, Y. Ueda, W. Kobayashi, H. Ishii, H. Sanjoh

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引用次数: 0

摘要

研制了具有倒装芯片互连的高速光发射机。倒装互连技术可以提供高调制带宽和低电串扰。我们用EADFB激光阵列模块实现了8 × 50 gbit /s的同时运算，用EADFB激光模块实现了100 gbit /s的同时运算。

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High-speed (>100 Gbit/s) EADFB laser module using flip-chip interconnection technique

High-speed optical transmitters with a flip-chip interconnection were developed. The flip-chip interconnection technique can provide a high modulation bandwidth and low electrical crosstalk. We achieved 8 × 50-Gbit/s simultaneous operation with an EADFB laser array module and 100-Gbit/s operation with an EADFB laser module.

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2016 IEEE Photonics Conference (IPC)

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