低温直流磁控溅射沉积SiC厚膜的场发射特性

Y. J. Wei, H. Qi, W. Wu
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引用次数: 0

摘要

采用80W、100W、120W和150W不同直流功率的烧结SiC靶材,采用直流磁控溅射沉积方法,在p型《100》取向硅衬底上,在较低温度下成功制备了非晶SiC厚膜。沉积氩气压力恒定在2.0Pa。采用x射线衍射、原子力显微镜(AFM)和轮廓仪对生长的SiC薄膜进行了表征。在阳极-样品距离为200µm的场发射特性测量中获得了约3.5V/µm的低导通场,这表明SiC薄膜是场发射真空微电子器件的有力候选材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Field emission property of SiC thick film deposited at low temperature by DC magnetron sputtering
The amorphous SiC thick films were successfully fabricated on P-type ≪100≫ oriented silicon substrates at comparatively low temperature via DC magnetron sputtering deposition using a sintered SiC target with different DC power of 80W, 100W, 120W, and 150W. The deposition argon pressure was constantly at 2.0Pa. The as-grown SiC films were characterized by using X-ray diffraction, Atomic Force Microscope (AFM) and profilometer. The low turn-on field of about 3.5V/µm obtained from the field-emission property measurement at an anode-sample separation of 200µm shows that SiC films are competitive candidates for field-emission-based vacuum microelectronic devices.
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