计算短跑

Arun Raghavan, Yixin Luo, Anuj Chandawalla, M. Papaefthymiou, K. Pipe, T. Wenisch, Milo M. K. Martin
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引用次数: 181

摘要

虽然晶体管密度继续增加,但电压缩放已经停滞不前,因此功率密度每一代技术都在增加。特别是在散热选择有限的移动设备中,这些趋势导致了持续的芯片性能主要受到功率而不是面积的限制。然而,许多移动应用并不要求持续的性能;相反,它们包含响应零星用户活动的短时间计算。为了提高这些应用程序的响应性,本文探讨了激活其他断电的核心以进行亚秒级的密集并行计算。该方法利用了计算冲刺的概念,即芯片暂时超过其可持续热功率预算以提供瞬时吞吐量,之后芯片必须返回标称运行以冷却。为了证明这种方法的可行性,我们分析了一个类似智能手机的系统的热学和电特性,该系统名义上是单核运行(峰值约1W),但可以在数百毫秒内冲刺多达16个核。我们描述了一种集成相变材料的热设计,以提供热电容以实现这种冲刺。我们分析了图像识别内核,表明并行冲刺有可能在1W移动平台的热约束下实现16W芯片的任务响应时间。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Computational sprinting
Although transistor density continues to increase, voltage scaling has stalled and thus power density is increasing each technology generation. Particularly in mobile devices, which have limited cooling options, these trends lead to a utilization wall in which sustained chip performance is limited primarily by power rather than area. However, many mobile applications do not demand sustained performance; rather they comprise short bursts of computation in response to sporadic user activity. To improve responsiveness for such applications, this paper explores activating otherwise powered-down cores for sub-second bursts of intense parallel computation. The approach exploits the concept of computational sprinting, in which a chip temporarily exceeds its sustainable thermal power budget to provide instantaneous throughput, after which the chip must return to nominal operation to cool down. To demonstrate the feasibility of this approach, we analyze the thermal and electrical characteristics of a smart-phone-like system that nominally operates a single core (~1W peak), but can sprint with up to 16 cores for hundreds of milliseconds. We describe a thermal design that incorporates phase-change materials to provide thermal capacitance to enable such sprints. We analyze image recognition kernels to show that parallel sprinting has the potential to achieve the task response time of a 16W chip within the thermal constraints of a 1W mobile platform.
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