K. Vaesen, R. Jansen, W. De Raedt, H. Kuwabara, Takahiko Kishi, Kazunari Nawa, Takeshi Bessho
{"title":"多层PCB设计库的射频无源建模","authors":"K. Vaesen, R. Jansen, W. De Raedt, H. Kuwabara, Takahiko Kishi, Kazunari Nawa, Takeshi Bessho","doi":"10.1109/RWS.2010.5434136","DOIUrl":null,"url":null,"abstract":"In this work a RF component design library has been developed for high performance 6-layered PCBs using a new plating technology. The design library consists of scalable models that are fitted on measurements. It is shown that the high performance PCB exhibits a better transmission line RF performance and also higher Q values for integrated inductors.","PeriodicalId":334671,"journal":{"name":"2010 IEEE Radio and Wireless Symposium (RWS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-01-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"RF passives modeling for a multilayer PCB design library\",\"authors\":\"K. Vaesen, R. Jansen, W. De Raedt, H. Kuwabara, Takahiko Kishi, Kazunari Nawa, Takeshi Bessho\",\"doi\":\"10.1109/RWS.2010.5434136\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this work a RF component design library has been developed for high performance 6-layered PCBs using a new plating technology. The design library consists of scalable models that are fitted on measurements. It is shown that the high performance PCB exhibits a better transmission line RF performance and also higher Q values for integrated inductors.\",\"PeriodicalId\":334671,\"journal\":{\"name\":\"2010 IEEE Radio and Wireless Symposium (RWS)\",\"volume\":\"86 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-01-10\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE Radio and Wireless Symposium (RWS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RWS.2010.5434136\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE Radio and Wireless Symposium (RWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2010.5434136","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
RF passives modeling for a multilayer PCB design library
In this work a RF component design library has been developed for high performance 6-layered PCBs using a new plating technology. The design library consists of scalable models that are fitted on measurements. It is shown that the high performance PCB exhibits a better transmission line RF performance and also higher Q values for integrated inductors.