工业应用中直接x射线对CMOS APS成像仪的影响

K. H. Kim, G. Cho
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引用次数: 3

摘要

本文利用调制传递函数(MTF)、噪声功率谱(NPS)和探测量子效率(DQE)分析了直接x射线后闪烁体对CMOS APS成像仪的影响。假设PCB检测等工业应用,采用连续制造微聚焦x射线机,在300mm的SID处设置50 kVp的x射线管电压。Lanex屏幕耦合CMOS APS成像仪长期辐照。从实验结果来看,暗电流或暗信号增加导致动态范围减小,MTF和DQE呈指数级下降。在给定的闪烁体和曝光条件下,使用CMOS APS作为基本传感器阵列会导致图像性能下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The effect of direct x-ray on CMOS APS imager for industrial application
In this paper, we presented the effect of direct X-ray after scintillator on the CMOS APS imager using modulation transfer function (MTF), noise power spectrum (NPS), and detective quantum efficiency (DQE). 50 kVp of X-ray tube voltage at the SID of 300 mm were set with continuous made micro-focus X-ray machine on the assumption for industrial application such as PCB inspection. Lanex screen coupled CMOS APS imager was irradiated for long-term. From the experimental results, MTF and also DQE were degraded exponentially because of reduction of dynamic range caused by dark current or dark signal increase. For a given scintillator and an exposure condition, the degradation of image performance can be expected in case that the CMOS APS be used as a basic sensor array.
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