一种全双工高隔离寄生贴片天线系统

2021 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS) Pub Date : 2021-05-18 DOI:10.1109/WMCS52222.2021.9493280

Abdul Rakib Hossain, T. Nguyen, T. Karacolak

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引用次数: 0

摘要

提出了一种采用180°混合耦合器馈电的d形寄生贴片天线，用于全双工通信。这个天线有三层基板。在顶层，有三个寄生片，一个是D形的，另外两个是矩形的，用来提高带宽。混合耦合器在第三层的底部。该天线的带宽为130 MHz，范围为2.31 GHz至2.44 GHz，隔离度小于-50 dB。在2.375 GHz(该天线的中心频率)范围内，TX和RX的增益均超过4 dB。

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A Parasitic Patch Antenna System with High Isolation for Full Duplex Application

This paper proposes a D-Shaped parasitic patch antenna fed with a 180° hybrid coupler for full duplex communication. This antenna has three layers of substrates. Over the top layer, there are three parasitic patches one is D shaped and the other two are rectangular shapes which are used to improve the bandwidth. A Hybrid coupler is on the bottom of the third layer. The proposed antenna has a bandwidth of 130 MHz from 2.31 GHz to 2.44 GHz with less than -50 dB isolation. It has gain over 4 dB for both TX and RX in 2.375 GHz which is the center frequency for this antenna.

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来源期刊

2021 IEEE Texas Symposium on Wireless and Microwave Circuits and Systems (WMCS)

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