{"title":"垂直互连中的串扰分析","authors":"Xidong Wu, T. van Deventer","doi":"10.1109/EUMA.1996.337626","DOIUrl":null,"url":null,"abstract":"Digital and microwave IC's provide a high level of integration through multilayered technology which may introduce parasitic effects such as crosstalk and resonances. A finite-difference time-domain (FDTD) technique is applied to analyze crosstalk in vertical transitions such as buried and through vias. Their parasitic contribution at high frequencies is studied here.","PeriodicalId":219101,"journal":{"name":"1996 26th European Microwave Conference","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Analysis of crosstalk in vertical interconnects\",\"authors\":\"Xidong Wu, T. van Deventer\",\"doi\":\"10.1109/EUMA.1996.337626\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Digital and microwave IC's provide a high level of integration through multilayered technology which may introduce parasitic effects such as crosstalk and resonances. A finite-difference time-domain (FDTD) technique is applied to analyze crosstalk in vertical transitions such as buried and through vias. Their parasitic contribution at high frequencies is studied here.\",\"PeriodicalId\":219101,\"journal\":{\"name\":\"1996 26th European Microwave Conference\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 26th European Microwave Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EUMA.1996.337626\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 26th European Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.1996.337626","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Digital and microwave IC's provide a high level of integration through multilayered technology which may introduce parasitic effects such as crosstalk and resonances. A finite-difference time-domain (FDTD) technique is applied to analyze crosstalk in vertical transitions such as buried and through vias. Their parasitic contribution at high frequencies is studied here.
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