传统射频磁控溅射在SI上表征GAN/ALN

A. S. Bakri, N. Nafarizal, R. Ali, M. Ahmad, M. Z. Sahdan, A. Bakar, N. A. Raship, A. Aldalbahi
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引用次数: 0

摘要

氮化镓是一种iii -氮化物材料,通常用于发光二极管(LED)和电力电子器件中。氮化镓具有直接能隙和优良的热稳定性。氮化镓的商业生长方法包括金属有机化学气相沉积(MOCVD)、氢化物气相外延(HVPE)和分子束外延(MBE)。近年来,磁控溅射生长氮化镓因其低温沉积、低成本以及能产生良好晶体质量而受到越来越多的关注。在硅片上直接生长GaN会导致缺陷的存在。因此,在GaN生长之前,AlN层用作成核层。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Characterization of GAN/ALN on SI Using Conventional RF Magnetron Sputtering
Gallium nitride is a III-nitride material that commonly used in light emitting diode (LED) and power electronic devices. Gallium nitride has direct energy bandgap and excellent thermal stability. The growth of GaN are commercially available using metal organic chemical vapour deposition (MOCVD), hydride vapour phase epitaxy (HVPE) and molecular beam epitaxy (MBE). Recently, the growth of GaN using magnetron sputtering have attracted increasing attention due to low temperature deposition, low cost and the capability of magnetron sputtering produce good crystal quality of GaN. Growth of GaN directly on silicon wafer will lead to the presence of defects. Thus, the AlN layer uses as a nucleation layer before the growth of GaN.
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