3d - ic中基于气隙的同轴TSV与传统圆形TSV的性能比较

2013 8th IEEE Design and Test Symposium Pub Date : 2013-12-01 DOI:10.1109/IDT.2013.6727102

K. Salah

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引用次数: 1

摘要

本文对基于气隙的同轴TSV与传统圆形TSV的性能进行了比较。结果表明，与传统的圆形TSV和同轴TSV相比，气隙TSV减小了总寄生电容和总能量损失。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Performance comparison between air-gap based coaxial TSV and conventional circular TSV in 3D-ICs

In this paper, performance comparison between Air-Gap Based Coaxial TSV and conventional circular TSV are presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV.

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2013 8th IEEE Design and Test Symposium

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