具有寄生元件的GaN HEMT假导通现象分析

T. Iwaki, S. Ishiwaki, T. Sawada, Masayoshi Yamamoto
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引用次数: 7

摘要

宽带隙功率半导体器件正在取代Si-MOSFET或IGBT。GaN-HEMT由于其高频开关特性,实现了尺寸和重量的减小。然而,其高速开关特性和低阈值电压可能导致假导通现象,这对应用是致命的影响。如何通过改变电路条件来解决和避免这一问题已成为当务之急。从逆变器的简化等效电路出发,对微分方程进行了描述,并在一定的假设条件下进行了代数求解。同时,还建立了漏极电压方程。将栅极电压波动描述为包含栅极驱动电路和主潮流两种LC谐振现象的复合波形。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An analysis of false turn-on phenomenon of GaN HEMT with parasitic components
Wide band gap power semiconductor devices are now replacing the Si-MOSFET or IGBT. GaN-HEMT achieves the reduction in size and weight, thanks to its high frequency switching behavior. However, its high-speed switching characteristics and low threshold voltage may cause a false turn-on phenomenon, which is a fatal effect for the applications. It is urgent issue to tackle and avoid this problem by modifying the circuit conditions. We described differential equations from simplified equivalent circuit of inverter, and algebraically solved with some assumptions. At the same time, drain voltage equation is also developed. As a result, the gate voltage fluctuation was described as a composite waveform including two LC resonance phenomenon, which occur on gate drive circuit and main power flow.
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