与外国公司建立商业伙伴关系

L. Wagner
{"title":"与外国公司建立商业伙伴关系","authors":"L. Wagner","doi":"10.1109/ASMC.1996.558004","DOIUrl":null,"url":null,"abstract":"Summary form only given, as follows. One of the fundamental trends of the 80's and 90's has been the growth of international business ties between companies. This is even more true in electronics in general and among semiconductor equipment companies in particular. Initially, these ties were mostly concentrated in the area of trade, as companies attempted to leverage domestic market acceptance abroad. Increasingly, these bonds are becoming more sophisticated, involving marketing and sales joint ventures, R&D cooperation projects, technology acquisition, etc. The drivers behind this trend are a desire to concentrate on core competencies, the need to amortize R&D investments over as large a customer base as possible and the increasing familiarity with the international environment. However, while the rewards of international cooperation can be high, many obstacles usually have to be overcome before success is at hand, and a significant number of projects are abandoned along the way because the partners no longer have enough in common to warrant continuing support. In the international realm, these obstacles-by definition-can be traced back to poor communication and cultural misunderstandings. Indeed, very subtle differences in assumptions about basic business practices can rapidly derail even the best laid plans. It is therefore critical to look at foreign cooperative projects with a different eye, to be cognizant of the challenges ahead and not to underestimate the demands placed on the available project management pool. Practical examples will be given of both positive and less satisfactory outcomes.","PeriodicalId":325204,"journal":{"name":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-11-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Forming business partnerships with foreign corporations\",\"authors\":\"L. Wagner\",\"doi\":\"10.1109/ASMC.1996.558004\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Summary form only given, as follows. One of the fundamental trends of the 80's and 90's has been the growth of international business ties between companies. This is even more true in electronics in general and among semiconductor equipment companies in particular. Initially, these ties were mostly concentrated in the area of trade, as companies attempted to leverage domestic market acceptance abroad. Increasingly, these bonds are becoming more sophisticated, involving marketing and sales joint ventures, R&D cooperation projects, technology acquisition, etc. The drivers behind this trend are a desire to concentrate on core competencies, the need to amortize R&D investments over as large a customer base as possible and the increasing familiarity with the international environment. However, while the rewards of international cooperation can be high, many obstacles usually have to be overcome before success is at hand, and a significant number of projects are abandoned along the way because the partners no longer have enough in common to warrant continuing support. In the international realm, these obstacles-by definition-can be traced back to poor communication and cultural misunderstandings. Indeed, very subtle differences in assumptions about basic business practices can rapidly derail even the best laid plans. It is therefore critical to look at foreign cooperative projects with a different eye, to be cognizant of the challenges ahead and not to underestimate the demands placed on the available project management pool. Practical examples will be given of both positive and less satisfactory outcomes.\",\"PeriodicalId\":325204,\"journal\":{\"name\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-11-12\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.1996.558004\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE/SEMI 1996 Advanced Semiconductor Manufacturing Conference and Workshop. Theme-Innovative Approaches to Growth in the Semiconductor Industry. ASMC 96 Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.1996.558004","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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摘要

仅给出摘要形式,如下。80年代和90年代的基本趋势之一是公司之间国际商业联系的增长。在整个电子行业,尤其是半导体设备公司,更是如此。最初,这些联系主要集中在贸易领域,因为公司试图利用国内市场在国外的接受度。这些债券越来越复杂,涉及营销和销售合资企业、研发合作项目、技术收购等。这一趋势背后的驱动因素是专注于核心竞争力的愿望,在尽可能大的客户群上分摊研发投资的需要,以及对国际环境的日益熟悉。然而,虽然国际合作的回报可能很高,但在取得成功之前通常必须克服许多障碍,而且在此过程中,由于合作伙伴不再有足够的共同点来保证继续提供支持,大量项目被放弃。在国际领域,这些障碍——顾名思义——可以追溯到沟通不畅和文化误解。事实上,对基本商业惯例的假设存在非常细微的差异,即使是最周密的计划也会迅速脱轨。因此,关键是要以不同的眼光看待外国合作项目,认识到未来的挑战,不要低估对现有项目管理资源的需求。将给出积极和不太令人满意的结果的实际例子。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Forming business partnerships with foreign corporations
Summary form only given, as follows. One of the fundamental trends of the 80's and 90's has been the growth of international business ties between companies. This is even more true in electronics in general and among semiconductor equipment companies in particular. Initially, these ties were mostly concentrated in the area of trade, as companies attempted to leverage domestic market acceptance abroad. Increasingly, these bonds are becoming more sophisticated, involving marketing and sales joint ventures, R&D cooperation projects, technology acquisition, etc. The drivers behind this trend are a desire to concentrate on core competencies, the need to amortize R&D investments over as large a customer base as possible and the increasing familiarity with the international environment. However, while the rewards of international cooperation can be high, many obstacles usually have to be overcome before success is at hand, and a significant number of projects are abandoned along the way because the partners no longer have enough in common to warrant continuing support. In the international realm, these obstacles-by definition-can be traced back to poor communication and cultural misunderstandings. Indeed, very subtle differences in assumptions about basic business practices can rapidly derail even the best laid plans. It is therefore critical to look at foreign cooperative projects with a different eye, to be cognizant of the challenges ahead and not to underestimate the demands placed on the available project management pool. Practical examples will be given of both positive and less satisfactory outcomes.
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