硅酸铪薄膜中的双稳态电阻开关

M. Saleh, D. Belay, T. Kim, R. Elliman
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引用次数: 0

摘要

本文报道了直流磁控溅射硅酸铪(HfxSi1−xO2)记忆薄膜的电阻开关机理。观察到,这些薄膜的电铸取决于绝缘体的厚度和化学计量,以及顶部电极(TE)的大小。高导态(ON)和低导态(OFF)都是非极性和稳定的。ON与OFF的阻值之比大于103。这两种状态都是通过直流电压扫描和施加短脉冲来实现的,在85°C下0.2V的读出电压下稳定超过104s,这是进一步电阻式随机存取存储器(RRAM)应用的基本特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bistable resistive switching in hafnium-silicate thin films
We report on the resistive switching mechanism of dc magnetron sputtered hafnium-silicates (HfxSi1−xO2) memory thin films. It is observed that the electroforming of these films depends on the thickness and stoichiometry of the insulator as well as on the size of the top electrode (TE). Both high-conducting state (ON) and low-conducting state (OFF) are non-polar and stable. The ratio of resistance of the ON and the OFF state is greater than 103. Both states, performed by dc voltage sweeping and applying short pulses, are stable over 104s at a read out voltage of 0.2V at 85°C, which are all essential properties for further resistive random access memory (RRAM) applications.
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