一种新的光伏晶圆技术即将到来，即EFG多晶硅片制造的某些方面

Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996 Pub Date : 1996-05-13 DOI:10.1109/PVSC.1996.564024

M.J. Kardauskas, M. Rosenblum, B. Mackintosh, J. Kalejs

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引用次数: 15

摘要

作者追溯了过去25年开创性的研究和开发经验，这些经验导致了利用边缘定义薄膜供给生长(EFG)技术生产的多晶硅晶片的光伏组件的全面生产线。他们详细研究了晶体生长生产率和晶圆体质量这两个核心领域的进展，这证明了日月光美洲公司最近将EFG技术扩大到多兆瓦水平是合理的。他们确定了未来的进展将使晶体硅基EFG技术能够与2000年以后光伏市场预期的成本目标竞争的领域。

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The coming of age of a new PV wafer technology-some aspects of EFG polycrystalline silicon sheet manufacture

The authors trace the pioneering research and development experiences over the past 25 years which have led to a full scale manufacturing line for photovoltaic modules utilizing polycrystalline silicon wafers produced by the edge-defined film-fed growth (EFG) technique. They examine the progress made in two core areas in detail-crystal growth productivity and wafer bulk quality-which have justified the recent scale up of EFG technology at ASE Americas to the multi-megawatt level. They identify areas in which future advances will enable a crystalline silicon-based EFG technology to compete with cost targets anticipated for the photovoltaics marketplace beyond the year 2000.

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Conference Record of the Twenty Fifth IEEE Photovoltaic Specialists Conference - 1996

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