异步高速串行链路分析使用集成电荷事件检测

Aditya Dalakoti, Carrie Segal, Merritt Miller, F. Brewer
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引用次数: 2

摘要

我们提出了一个度量的事件检测,针对CMOS异步串行数据链路的分析。我们的度量用于分析信令策略,这些策略允许同时或几乎同时检测数据和事件定时。该指标预测,与传统定时链路相比,CMOS链路信号机制具有相当大的隐式色散和码间干扰容忍能力。事实上,在眼图技术预测链接故障的情况下,它预测正确的链接操作。对PCB和布线解决方案的实际操作边际和指标进行了描述和评估,表明可以在CMOS 130nm技术中实现10+ Gb/s低功耗异步链路。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Asynchronous high speed serial links analysis using integrated charge for event detection
We present a metric for event detection, targeted for the analysis of CMOS asynchronous serial data links. Our metric is used to analyze signaling strategies that allow for coincident or nearly coincident detection of both data and event timing. The metric predicts that the CMOS link signaling mechanism has substantial implicit dispersion and intersymbol interference [ISI] tolerance when compared to conventionally timed links. In fact, it predicts correct link operation in situations where eye-diagram techniques predict link failure. Practical operation margins and metrics are described and evaluated for PCB and cabling solutions suggesting 10+ Gb/s low-power asynchronous links could be implemented in CMOS 130nm technology.
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