应用低温等离子体改性技术探索纳米HMX的工艺流程

Xiaode Guo, Binbin Dong, Feng-sheng Li, Zhixiang Wang, Fei Wu
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引用次数: 0

摘要

首先,利用低温等离子体设备对纳米HMX进行加工。然后,利用湿式纳米Zetasizer和扫描电镜(SEM)对纳米HMX的分散和形貌进行了表征。利用傅里叶变换红外光谱仪(FT-IY)和x射线粉末衍射仪(XRD)和x射线光电子能谱仪(XPS)分析其主要成分、结构和表面元素价态的变化。最后通过差示扫描量热-热重分析(TG-DSC)分析纳米HMX的热分解特性。用冲击灵敏度测试仪测试其冲击灵敏度。结果表明,处理后的纳米HMX团聚还原分散性变好,处理后的纳米HMX冲击敏感性降低8.1%,提高了其安全性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Application of low temperature plasma modification explore the technical processing of nano HMX
Firstly, use the low temperature plasma equipment to process nano HMX. Then, use The dispersion and the morphology of nano HMX were characterized by Wet Zetasizer Nano and scanning electron microscope (SEM). Use fourier transform infrared spectrometer (FT-IY) and X-ray powder diffraction X-ray diffraction (XRD) and X-ray photoelectron spectrometer (XPS) to analyze its main composition, structure and surface element valence state changes. Finally, differential scanning calorimetry-thermogravimetric analysis (TG-DSC) to analyze the nanometer HMX thermal decomposition characteristics. Use the impact sensitivity test instrument to test its impact sensitivity. The result shows that treated nano HMX reunion reduce dispersion becomes better, treated nano HMX lower impact sensitivity of 8.1%, whitch improved its safety.
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