基于功率集电极和辅助集电极间寄生参数的无电流传感器IGBT结温提取方法

W. Shi, Xiang Wang, Yu Zhou, Haoze Luo, Wuhua Li, Xiangning He, Jun Ma, Guodong Chen, Ye Tian, Enxing Yang
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引用次数: 8

摘要

结温Tj的提取对IGBT模块的可靠性起着至关重要的作用。近年来,利用寄生参数提取Tj的方法因其可集成到驱动电路中而备受关注。然而,模块的老化会影响寄生参数,导致疲劳和老化时Tj提取不准确。本文首先详细分析了IGBT模块的内部结构和等效电路,证明了集电极的寄生参数远不如栅极和发射极的寄生参数容易老化。其次,提出了一种利用功率集热器与辅助集热器之间寄生参数提取Tj的改进方法。此外,由于该方法与驱动电流解耦,因此可以使用积分器准确地获取负载电流,从而避免了提取电流传感器的需要。最后,进行了一系列验证测试,验证了该方法的有效性和准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A current sensorless IGBT junction temperature extraction method via parasitic parameters between power collector and auxiliary collector
The extraction of junction temperature Tj plays a critical role in the IGBT module reliability. In recent years, the extraction of Tj via parasitic parameters has drawn much attention for its ability to be integrated in the driver circuit. However, the aging of modules can affect the parasitic parameters, leading to the inaccuracy of Tj extraction when fatigue and aging occurs. Firstly, this paper analyzes the inner structure and equivalent circuit of IGBT modules in detail and proves the parasitic parameters of collector far less susceptible from aging than parameters of gate and emitter. Secondly, an enhanced Tj extraction method via the parasitic parameters between the power collector and auxiliary collector is presented. Besides, Due to the decoupling of this method from the driver current, the load current can be acquired accurately with an integrator, which exempts the extraction from the need of a current sensor. Finally, a series of verification tests are handled to verify the validation and accuracy of the method.
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