尾随喷丸多焊平焊缝的温度场和应力场分布

Q. Bai, Yuejin Ma
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引用次数: 0

摘要

焊接是一个涉及物理、导热、冶金、力学等多种学科的复杂过程。当零件产生残余应力、裂纹、气孔等时,会降低焊接强度和焊接质量。消除残余应力的方法很多,但如何提高残余应力是一个难题。我们采用尾随喷丸焊接来减少残余应力。在这个过程中,重要的是要决定何时打开它。本文利用ANSYS软件对平板多焊缝的焊接过程进行仿真,利用间接耦合法,了解焊接后的温度场,从而为零件的喷焊做好准备。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The Temperature and Stress Field Distribution of Muti-welding Seam Flat with Trailing Peening
Welding is a complex process including of physics, conducting heat, metallurgy, mechanics. when producing residual stress, crack, air holes and so on in the parts, it will reduce welding strength and welding quality. Though there are many methods to relif residual stress, it is a difficult problem about how to improve it. We use welding with trailing peening to reduce residual stress. In the process it is important to decide when to peen it. In the article, using the software ANSYS to simulate muti-welding seam process of flat, taking advantage of indirect couple method, we can know temperature field after welding, so we can be ready to peen the part.
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