高功率OMP器件中铝线键合可靠性建模

R. Kregting, C. Yuan, A. Xiao, F. de Bruijn
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引用次数: 3

摘要

在射频电源应用(如OMP)中,导线承受大电流(由于高功率)和高温(由于IC的热量和导线本身的焦耳加热)。此外,导线形状对射频性能至关重要。因此,首选铝线,楔-楔焊线被广泛使用。由于线材形状设计不良,会出现楔断现象。此外,对于通常非常高且可以达到高温的shin线,可能会因线熔化而失效。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Modelling aluminium wire bond reliability in high power OMP devices
In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is preferred and wedge-wedge wire bonding is widely used. As a result of poor wire shape design, wedge break can be found. Additionally, for the in-shin wires, which are typically very high and can reach high temperatures, failure by wire melting can be reached.
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