在氧化铟锡埋设触点上用PECVD生长非晶硅波导

S. Rao, F. D. Della Corte, C. Summonte
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引用次数: 12

摘要

采用等离子体增强化学气相沉积(PECVD)技术在透明导电氧化物(TCO)层上实现了低损耗氢化非晶硅(α-Si∶H)波导,该氧化氧化物层可为开关和调制器等有源器件提供埋点。我们特别提出了一种技术解决方案,以克服由于金属接触的高消光系数而导致的光学透过率的大幅下降,同时克服在TCO上生长的α-Si∶H薄膜的织构效应引起的光学散射。用1550nm处的传播损耗和表面粗糙度对所制备的波导进行了表征。实验结果与光学模拟包计算结果进行了比较。计算结果与实验数据吻合较好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Amorphous silicon waveguides grown by PECVD on an Indium Tin Oxide buried contact
Low-loss hydrogenated amorphous silicon (α-Si∶H) waveguides were realized by plasma enhanced chemical vapour deposition (PECVD) on a transparent conductive oxide (TCO) layer which is intended to provide the buried contact in active devices, e.g switches and modulators. In particular we propose a technological solution to overcome both the strong reduction in optical transmittance due to the very high extinction coefficient of metal contacts and, at the same time, the optical scattering induced by the texturization effect induced on α-Si∶H films grown on TCO. The realized waveguides were characterized in terms of propagation losses at 1550nm and surface roughness. The experimental performances have been compared to those obtained through calculations using an optical simulation package. The results are found to be in agreement with the experimental data.
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