提高片上无源元件宽带建模的电磁仿真精度

T. Johansen, C. Jiang, D. Hadziabdic, V. Krozer
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引用次数: 45

摘要

本文介绍了利用电磁仿真提高片上无源元件宽带建模精度的方法。结果表明,在较低GHz频率范围之外,集成元件仿真的标准激励方案与片上测量结果的相关性较差。我们表明,这是由于寄生效应和高阶模式引起的激励方案。我们提出了一个简单的等效电路来处理众所周知的地环激励方案中的寄生效应。当应用于与激励方案相关的寄生效应去除时,扩展的L-2L校准方法显着提高了晶圆上组件建模的准确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
EM simulation accuracy enhancement for broadband modeling of on-wafer passive components
This paper describes methods for accuracy enhancement in broadband modeling of on-wafer passive components using electromagnetic (EM) simulation. It is shown that standard excitation schemes for integrated component simulation leads to poor correlation with on-wafer measurements beyond the lower GHz frequency range. We show that this is due to parasitic effects and higher-order modes caused by the excitation schemes. We propose a simple equivalent circuit for the parasitic effects in the well-known ground ring excitation scheme. An extended L-2L calibration method is shown to improve significantly the accuracy of the on-wafer component modeling, when applied to parasitic effect removal associated with the excitation schemes.
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