埋源VMOS动态RAM器件

J. Barnes, S. Shabde, F. Jenne
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引用次数: 11

摘要

埋源动态RAM器件将VMOS技术与1晶体管单元相结合,以实现高性能和高密度存储器(1)。本文介绍了该器件的实验和理论分析结果,因为它们适用于16K或64k位动态RAM。VMOST的阈值电压、击穿电压、弱反转电流、结漏电流和结电容在正向和反向工作模式下(源极和漏极反转)都与整个通道中掺杂谱线的形状有关。建立了VMOST短通道阈值电压与电池存储容量的关系式。最后,给出了单元刷新数据,证明了该器件作为动态存储元件的运行。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
The buried-source VMOS dynamic RAM device
The buried-source dynamic RAM device combines VMOS technology with the 1-transistor cell for a high performance and high density memory (1). This paper presents results of both experimental and theoretical analyses of the device as they apply to use in a 16K or 64K-bit dynamic RAM. The VMOST threshold voltage, breakdown voltage, weak inversion current, junction leakage current, and junction capacitance for both the forward and reverse mode of operation (reversal of source and drain) are experimentally related to the shape of the doping profile throughout the channel. Equations are developed for the VMOST short-channel threshold voltage and storage capacity of the cell. Finally, cell refresh data is presented that proves the operation of the device as a dynamic memory element.
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