利用动态耦合核形成弹性芯片多处理器

Christopher LaFrieda, Engin Ipek, José F. Martínez, R. Manohar
{"title":"利用动态耦合核形成弹性芯片多处理器","authors":"Christopher LaFrieda, Engin Ipek, José F. Martínez, R. Manohar","doi":"10.1109/DSN.2007.100","DOIUrl":null,"url":null,"abstract":"Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Existing fault-tolerant CMP proposals that implement dual modular redundancy (DMR) do so by statically binding pairs of adjacent cores via dedicated communication channels and buffers. This can result in unnecessary power and performance losses in cases where one core is defective (in which case the entire DMR pair must be disabled), or when cores exhibit different frequency/leakage characteristics due to process variations (in which case the pair runs at the speed of the slowest core). Static DMR also hinders power density/thermal management, as DMR pairs running code with similar power/thermal characteristics are necessarily placed next to each other on the die. We present dynamic core coupling (DCC), an architectural technique that allows arbitrary CMP cores to verify each other's execution while requiring no static core binding at design time or dedicated communication hardware. Our evaluation shows that the performance overhead of DCC over a CMP without fault tolerance is 3% on SPEC2000 benchmarks, and is within 5% for a set of scalable parallel scientific and data mining applications with up to eight threads (16 processors). Our results also show that DCC has the potential to significantly outperform existing static DMR schemes.","PeriodicalId":405751,"journal":{"name":"37th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN'07)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2007-06-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"145","resultStr":"{\"title\":\"Utilizing Dynamically Coupled Cores to Form a Resilient Chip Multiprocessor\",\"authors\":\"Christopher LaFrieda, Engin Ipek, José F. Martínez, R. Manohar\",\"doi\":\"10.1109/DSN.2007.100\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Existing fault-tolerant CMP proposals that implement dual modular redundancy (DMR) do so by statically binding pairs of adjacent cores via dedicated communication channels and buffers. This can result in unnecessary power and performance losses in cases where one core is defective (in which case the entire DMR pair must be disabled), or when cores exhibit different frequency/leakage characteristics due to process variations (in which case the pair runs at the speed of the slowest core). Static DMR also hinders power density/thermal management, as DMR pairs running code with similar power/thermal characteristics are necessarily placed next to each other on the die. We present dynamic core coupling (DCC), an architectural technique that allows arbitrary CMP cores to verify each other's execution while requiring no static core binding at design time or dedicated communication hardware. Our evaluation shows that the performance overhead of DCC over a CMP without fault tolerance is 3% on SPEC2000 benchmarks, and is within 5% for a set of scalable parallel scientific and data mining applications with up to eight threads (16 processors). Our results also show that DCC has the potential to significantly outperform existing static DMR schemes.\",\"PeriodicalId\":405751,\"journal\":{\"name\":\"37th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN'07)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-06-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"145\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"37th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN'07)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DSN.2007.100\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"37th Annual IEEE/IFIP International Conference on Dependable Systems and Networks (DSN'07)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DSN.2007.100","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 145

摘要

积极的CMOS缩放将使未来的芯片多处理器(cmp)越来越容易受到瞬态故障、硬错误、制造缺陷和工艺变化的影响。现有的容错CMP方案实现双模块冗余(DMR),通过专用通信通道和缓冲区静态绑定相邻的核对。在一个核心有缺陷的情况下(在这种情况下,整个DMR对必须禁用),或者当核心由于工艺变化而表现出不同的频率/泄漏特性时(在这种情况下,对以最慢核心的速度运行),这可能导致不必要的功率和性能损失。静态DMR也阻碍了功率密度/热管理,因为DMR对运行的代码具有相似的功率/热特性,必须在模具上彼此相邻放置。我们提出了动态核心耦合(DCC),这是一种架构技术,允许任意CMP核心验证彼此的执行,同时在设计时不需要静态核心绑定或专用通信硬件。我们的评估表明,在SPEC2000基准测试中,DCC在无容错的CMP上的性能开销为3%,对于一组具有多达8个线程(16个处理器)的可扩展并行科学和数据挖掘应用程序,其性能开销在5%以内。我们的研究结果还表明,DCC具有显著优于现有静态DMR方案的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Utilizing Dynamically Coupled Cores to Form a Resilient Chip Multiprocessor
Aggressive CMOS scaling will make future chip multiprocessors (CMPs) increasingly susceptible to transient faults, hard errors, manufacturing defects, and process variations. Existing fault-tolerant CMP proposals that implement dual modular redundancy (DMR) do so by statically binding pairs of adjacent cores via dedicated communication channels and buffers. This can result in unnecessary power and performance losses in cases where one core is defective (in which case the entire DMR pair must be disabled), or when cores exhibit different frequency/leakage characteristics due to process variations (in which case the pair runs at the speed of the slowest core). Static DMR also hinders power density/thermal management, as DMR pairs running code with similar power/thermal characteristics are necessarily placed next to each other on the die. We present dynamic core coupling (DCC), an architectural technique that allows arbitrary CMP cores to verify each other's execution while requiring no static core binding at design time or dedicated communication hardware. Our evaluation shows that the performance overhead of DCC over a CMP without fault tolerance is 3% on SPEC2000 benchmarks, and is within 5% for a set of scalable parallel scientific and data mining applications with up to eight threads (16 processors). Our results also show that DCC has the potential to significantly outperform existing static DMR schemes.
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