{"title":"基于自传感压电传感器的键合过程监测","authors":"M. Brokelmann, J. Wallaschek, H. Hesse","doi":"10.1109/FREQ.2004.1418440","DOIUrl":null,"url":null,"abstract":"Process monitoring via self-sensing piezoelectric transducers was applied to wire bonding. Starting with a description of the state of the art in bond process monitoring this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.","PeriodicalId":369162,"journal":{"name":"Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004.","volume":"105 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":"{\"title\":\"Bond process monitoring via self-sensing piezoelectric transducers\",\"authors\":\"M. Brokelmann, J. Wallaschek, H. Hesse\",\"doi\":\"10.1109/FREQ.2004.1418440\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Process monitoring via self-sensing piezoelectric transducers was applied to wire bonding. Starting with a description of the state of the art in bond process monitoring this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.\",\"PeriodicalId\":369162,\"journal\":{\"name\":\"Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004.\",\"volume\":\"105 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-08-23\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/FREQ.2004.1418440\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the 2004 IEEE International Frequency Control Symposium and Exposition, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/FREQ.2004.1418440","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Bond process monitoring via self-sensing piezoelectric transducers
Process monitoring via self-sensing piezoelectric transducers was applied to wire bonding. Starting with a description of the state of the art in bond process monitoring this paper introduces the concept of self-sensing piezoelectric transducers and reports first experimental results which have been obtained by using this technique.