M. Kościelski, K. Bukat, J. Sitek, M. Jakubowska, W. Niedźwiedź, A. Mlozniak
{"title":"添加纳米银粉和碳纳米管的Sac 305焊锡膏。焊锡膏和焊点的基本性质","authors":"M. Kościelski, K. Bukat, J. Sitek, M. Jakubowska, W. Niedźwiedź, A. Mlozniak","doi":"10.1109/ISSE.2012.6273162","DOIUrl":null,"url":null,"abstract":"In the previous work we have been engaged in experiments of the solder paste consisting of nanoparticles of silver with different grain sizes, and also carbon nanotubes (CNT) before and after modification. The basic properties of the tested pastes were very promising. Here we would like to present our findings on mixed solder pastes that consist of silver nanopowder and modified CNT. Such mixtures have not been presented in the literature yet. In this article the results of basic tests such as slump, solder ball etc. as well as results of shear tests of solder joints will be presented.","PeriodicalId":277579,"journal":{"name":"2012 35th International Spring Seminar on Electronics Technology","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-05-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Sac 305 solder paste with silver nanopowder and carbon nanotubes addition - basic properties of pastes and solder joints\",\"authors\":\"M. Kościelski, K. Bukat, J. Sitek, M. Jakubowska, W. Niedźwiedź, A. Mlozniak\",\"doi\":\"10.1109/ISSE.2012.6273162\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the previous work we have been engaged in experiments of the solder paste consisting of nanoparticles of silver with different grain sizes, and also carbon nanotubes (CNT) before and after modification. The basic properties of the tested pastes were very promising. Here we would like to present our findings on mixed solder pastes that consist of silver nanopowder and modified CNT. Such mixtures have not been presented in the literature yet. In this article the results of basic tests such as slump, solder ball etc. as well as results of shear tests of solder joints will be presented.\",\"PeriodicalId\":277579,\"journal\":{\"name\":\"2012 35th International Spring Seminar on Electronics Technology\",\"volume\":\"45 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-05-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2012 35th International Spring Seminar on Electronics Technology\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSE.2012.6273162\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 35th International Spring Seminar on Electronics Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSE.2012.6273162","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Sac 305 solder paste with silver nanopowder and carbon nanotubes addition - basic properties of pastes and solder joints
In the previous work we have been engaged in experiments of the solder paste consisting of nanoparticles of silver with different grain sizes, and also carbon nanotubes (CNT) before and after modification. The basic properties of the tested pastes were very promising. Here we would like to present our findings on mixed solder pastes that consist of silver nanopowder and modified CNT. Such mixtures have not been presented in the literature yet. In this article the results of basic tests such as slump, solder ball etc. as well as results of shear tests of solder joints will be presented.
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