{"title":"RG-SRAM:一种低栅漏存储器设计","authors":"Charan Thondapu, P. Elakkumanan, R. Sridhar","doi":"10.1109/ISVLSI.2005.64","DOIUrl":null,"url":null,"abstract":"The gate oxide thickness in sub-70nm process technologies approaches the limit where direct gate tunneling current starts to play a significant role in both off-state and on-state transistors. In this paper, we present a novel reduced-gate SRAM (RG-SRAM) that uses two additional PMOS pass transistors to decrease the gate leakage dissipation in very deep sub-micron (VDSM) cache and embedded memories.","PeriodicalId":158790,"journal":{"name":"IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-05-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"RG-SRAM: a low gate leakage memory design\",\"authors\":\"Charan Thondapu, P. Elakkumanan, R. Sridhar\",\"doi\":\"10.1109/ISVLSI.2005.64\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The gate oxide thickness in sub-70nm process technologies approaches the limit where direct gate tunneling current starts to play a significant role in both off-state and on-state transistors. In this paper, we present a novel reduced-gate SRAM (RG-SRAM) that uses two additional PMOS pass transistors to decrease the gate leakage dissipation in very deep sub-micron (VDSM) cache and embedded memories.\",\"PeriodicalId\":158790,\"journal\":{\"name\":\"IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)\",\"volume\":\"60 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-05-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISVLSI.2005.64\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Computer Society Annual Symposium on VLSI: New Frontiers in VLSI Design (ISVLSI'05)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISVLSI.2005.64","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The gate oxide thickness in sub-70nm process technologies approaches the limit where direct gate tunneling current starts to play a significant role in both off-state and on-state transistors. In this paper, we present a novel reduced-gate SRAM (RG-SRAM) that uses two additional PMOS pass transistors to decrease the gate leakage dissipation in very deep sub-micron (VDSM) cache and embedded memories.