热载流子应力n-MOSFET中电压缩放和温度对漏极漏电流衰减的影响

Tahui Wang, C. Hsu, L. Chiang, N. Zous, T. Chao, C. Chang
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引用次数: 3

摘要

对热载流子应力n-MOSFET在零V/sub /下的漏极漏电流退化进行了测量和建模。研究了漏极漏电流随电源电压和温度的变化规律。在建模中,考虑了漏极漏源亚阈值漏电流、带到带隧道电流和界面陷阱辅助漏电流等漏极漏电流机制。结果表明,当电源电压低于3.0 V时,界面阱诱导漏电流是漏极泄漏的主要机制。由于热载流子应力的作用,漏极漏电流下降了几个数量级。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET
Drain leakage current degradation at zero V/sub gs/ in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. The results show that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.
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