用于自动波峰焊系统的线性电磁泵

J. Onozaki, T. Masuda, H. Saitohi, K. Takahashi
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引用次数: 0

摘要

波峰焊系统在电路板组装过程中已经使用了50多年,但仍未满足免维护操作、高可焊性和缩小焊料容量的需求。为了满足这些要求,作者实际应用了一种波峰焊系统,该系统通过线性电磁泵对熔融焊料施加直接推力,从而实现了免维护系统,降低了1/10至1/20的缺陷率,减少了57%的焊料容量。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Linear electromagnetic pump for automatic wave soldering system
A wave soldering system has been used for more than 50 years in the process of circuit board assembly, but the needs for maintenance-free operations, high solderability, and downsizing of the solder capacity have still not been met. To meet these requirements, the authors made practical use of a wave soldering system in which a direct thrust is applied to the molten solder by means of a linear electromagnetic pump, thus realizing maintenance-free system, a 1/10 to 1/20 reduction of the defect rate, and a 57% reduction of the solder capacity.
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