采用自动对焦技术的集成电路线键自动目视检测

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398225

H. Lim, Wei Zhang, L. M. Koh

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引用次数: 4

摘要

研制成功了一种自动集成电路(IC)焊丝键合检测系统。该系统能够测量键的高度和直径。通过使用一系列键的二维图像自动计算键的顶部和底部的聚焦平面来检测键的高度。通过提取图像的高频特征得到图像的聚焦平面。通过水平和垂直扫描图像灰度的急剧变化，计算键的直径。该系统以每分钟6键的速度完成测量任务。测量高度和直径可获得/spl plusmn/0.9 /spl mu/m和/spl plusmn/2.0 /spl mu/m的精度

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Automated visual inspection for IC wire-bond using auto-focusing technique

An automated integrated circuit (IC) wire-bond inspection system has been successfully developed. The system is capable of measuring the height and diameter of the bonds. The bond height is detected by automatically computing the focused planes of the top and the base of the bond with a series of two-dimensional images of the bond. The focused plane of an image is obtained by extracting the high-frequency features of the image. By scanning horizontally and vertically for a steep change in gray level of the image, the diameter of the bond is calculated. The system carries out the measurement task at a speed of six bonds per minute. Precision of /spl plusmn/0.9 /spl mu/m and /spl plusmn/2.0 /spl mu/m for the height and diameter measurement can be obtained.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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