通过对片式电容器附着物中氯化溶剂去除的比较鉴定

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398206

J. A. Steele, K. B. Gould, D.G. Siden, H. Simmons

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引用次数: 0

摘要

非清洁焊膏的资格消除了在半导体制造中使用氟氯化碳(CFCs)。免清洁也减少了化学品的使用和资本设备的需求。无清洁膏体选择过程证明是成功的。比较鉴定是保证所需可靠性的有效方法。

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Chlorinated solvent elimination in chip capacitor attach using qualification by comparison

The qualification of a no-clean solder paste eliminate the use of chlorofluorocarbons (CFCs) in semiconductor manufacturing. The no-clean also reduces chemical usage and capital equipment needs. The no-clean paste selection process proves successful. Qualification by comparison provides an effective way to ensure the needed reliability.<>

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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