通过结构参数化来解决PCIe 5gt /s高速不连续问题

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS) Pub Date : 1900-01-01 DOI:10.1109/EDAPS.2016.7893139

Chua Fu Lien, Koh Wee Jin

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引用次数: 1

摘要

通孔结构可以参数化为由块构件组成的模型。该模型可用于解决PCIe高速通道不连续等SI问题。本文提出的参数化通孔方法提高了PCIe 5gt /s通道的性能，该通道由不可避免的VPX连接器通孔存根组成，并且加快了解决通孔不连续问题的仿真时间。

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Parameterize via structure to resolve high speed discontinuity in PCIe 5 GT/s

Via structure can be parameterized into model consisting of lump components. This model can be used for resolving SI issues such as discontinuities on PCIe high speed channel. In this paper, the proposed approach on parameterizing the via has improved the performance of PCIe 5 GT/s channels, consisting of unavoidable VPX connector via stubs, and also hasten the simulation time to resolve via discontinuity.

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来源期刊

2016 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS)

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