ENIG孔垂直充填不良的失效分析

2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS) Pub Date : 2016-10-01 DOI:10.1109/ICRMS.2016.8050045

Jianghua Shen, Chao-Kun Hu, Xiao He

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引用次数: 0

摘要

波峰焊是电子工业中应用最广泛的焊接方法之一。然而，造成焊接失败的因素有很多。本文介绍了波峰焊纵向充填失效分析的典型案例。通过表面元素检测、垂直截面、金属间化合物(IMC)厚度测量、能谱分析(EDS)等一系列分析，认为焊接热不够是导致焊缝垂直填充不良的主要原因。污染表面和Ni腐蚀加剧了破坏。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Failure analysis for poor vertical fill of ENIG holes

Wave soldering is one of the most widely used soldering methods in the electronics industry. However there are many influences that caused to soldering failure. This article presents a typical case about poor vertical fill failure analysis during wave soldering. Base on a series analysis, such as surface element detected, vertical cross section, thickness of inter-metallic compound (IMC) measurement, energy dispersive spectroscopy (EDS) analysis etc, the poor vertical fill failure is primarily attribute to that the soldering heat is not enough. The contaminated surface and the Ni corroded intensify the failure.

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2016 11th International Conference on Reliability, Maintainability and Safety (ICRMS)

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