Mathematical Description of Nano Indentation Unloading Curve of Ceramic Materials and Test Method of Film Thickness

: The indentation unloading curve of ceramic materials describes the contact position and thickness between solid film and substrate. Ceramic films are widely used in modern industry, national defense, military and electronic devices. They have the advantages of low density, high specific strength, high temperature resistance and good oxidation resistance. The film thickness is one of the important parameters reflecting the preparation process. It will not only affect the material itself, but also damage the adjacent surface. Therefore, the mechanical properties should be improved by controlling the pressure applied to the substrate interface. Based on the preparation process, this paper introduces the nano indentation unloading curve test of ceramic thin-layer samples by indentation method, studies the changes of material properties and mechanical properties under different thickness and temperature, and describes the microstructure of ceramic thin-film and analyzes its compactness and microstructure by load displacement curve. After a series of experimental tests, the mathematical description of nano unloading curve of ceramic materials and the method of film thickness measurement are summarized.