利用不同类型和厚度的金属触点制备掺铝ZnO纳米棒阵列

A. S. Ismail, M. H. Mamat, M. F. Malek, M. A. Abdullah, W. Ahmad, M. Yusoff, R. Mohamed, N. Sin, A. Suriani, M. Rusop
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引用次数: 0

摘要

采用浸渍法在种子层镀膜玻璃基板上合成了al掺杂ZnO纳米棒阵列。对金属触点进行了优化,考察了不同类型和厚度的金属触点对纳米棒阵列薄膜电性能的影响。对于金属接触类型的优化,铂(Pt)在低电阻薄膜上表现出最好的电性能。为了优化接触厚度,选择了Pt,表征表明,90 nm的Pt具有最佳的电学性能,薄膜电阻最低,为0.24 MΩ。利用FESEM和XRD对薄膜的结构性能进行了表征,以证实ZnO纳米棒阵列的有效性。采用I-V测量方法研究了不同接触厚度下薄膜的电学性能。测量结果表明,在接触厚度为90 nm时,薄膜的电阻最小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Fabrication of Al-doped ZnO nanorod array using different type and thickness of metal contact
Al-doped ZnO nanorod arrays were synthesized on seed layer coated glass substrate using immersion method. Optimization on the metal contact was conducted whereby the effect different types and thicknesses of metal contacts to the electrical properties of the nanorod array films were investigated. For the optimization of metal contact types, platinum (Pt) displayed the best electrical properties with low resistance film. For the optimization of contact thickness, Pt was selected and the characterization showed that Pt with 90 nm has the best electrical properties with the lowest film resistance of 0.24 MΩ. The structural properties of the film were characterized using FESEM and XRD to confirm the availability of ZnO nanorod arrays. The electrical properties of the films at different contact thicknesses were investigated using I-V measurement. Based on the measurement, it is observed that 90 nm contact thickness produce the lowest resistance film.
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