{"title":"基板集成波导(SIW)滤波器:设计方法与性能研究","authors":"G. Romo, A. Scogna","doi":"10.1109/IMWS.2009.4814901","DOIUrl":null,"url":null,"abstract":"A high-performance substrate integrated waveguide (SIW) filter formed by top and bottom metal layers which embed a dielectric slab and two sidewalls of metallic vias is presented. Two different configurations (named as in-line and off-line) are proposed and two different design techniques are discussed: direct method and indirect method. In both cases modeled/simulated results are validated by means of measurements and good agreement is observed over the whole frequency range 0-110GHz. The indirect method allows the prediction of the stop bands with very small computational effort; therefore it is a very promising technique for design of SIW structures.","PeriodicalId":368866,"journal":{"name":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-04-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Substrate integrated waveguide (SIW) filter: design methodology and performance study\",\"authors\":\"G. Romo, A. Scogna\",\"doi\":\"10.1109/IMWS.2009.4814901\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A high-performance substrate integrated waveguide (SIW) filter formed by top and bottom metal layers which embed a dielectric slab and two sidewalls of metallic vias is presented. Two different configurations (named as in-line and off-line) are proposed and two different design techniques are discussed: direct method and indirect method. In both cases modeled/simulated results are validated by means of measurements and good agreement is observed over the whole frequency range 0-110GHz. The indirect method allows the prediction of the stop bands with very small computational effort; therefore it is a very promising technique for design of SIW structures.\",\"PeriodicalId\":368866,\"journal\":{\"name\":\"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-04-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMWS.2009.4814901\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE MTT-S International Microwave Workshop Series on Signal Integrity and High-Speed Interconnects","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMWS.2009.4814901","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Substrate integrated waveguide (SIW) filter: design methodology and performance study
A high-performance substrate integrated waveguide (SIW) filter formed by top and bottom metal layers which embed a dielectric slab and two sidewalls of metallic vias is presented. Two different configurations (named as in-line and off-line) are proposed and two different design techniques are discussed: direct method and indirect method. In both cases modeled/simulated results are validated by means of measurements and good agreement is observed over the whole frequency range 0-110GHz. The indirect method allows the prediction of the stop bands with very small computational effort; therefore it is a very promising technique for design of SIW structures.