全芯片可靠性分析

1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173) Pub Date : 1998-06-01 DOI:10.1109/RELPHY.1998.670669

S. Rochel, G. Steele, J. Lloyd, S. Z. Hussain, D. Overhauser

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引用次数: 29

摘要

可靠性分析还没有被提升到全芯片领域，因为以前还没有技术来提取、管理和处理全芯片电网和信号数据。本文介绍了已经开发的技术，以允许全芯片电网和信号网电迁移和焦耳加热分析。分析的结果为设计人员提供反馈，使设计修改变得容易，从而提供卓越的“设计内”长期可靠性。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Full-chip reliability analysis

Reliability analysis has not been promoted to the full-chip realm because techniques to extract, manage, and process full-chip power grid and signal data have not been previously available. This paper introduces techniques that have been developed to permit both full-chip power grid and signal net electromigration and Joule heating analysis. Results of this analysis provide feedback to the designer to permit easy design modification to provide superior "designed-in" long term reliability.

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来源期刊

1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)

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