基于分子动力学模拟的二维IV A材料热导率研究进展

Yucheng Yang
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摘要

本文介绍了利用分子动力学理论模拟以石墨烯为代表的二维IV A材料导热性能的研究过程。主要工作包括使用Materials Studio构建材料模型,将模型导入Lammps进行模拟计算,使用非平衡分子动力学(NEMD)计算导热系数。总结了几种二维IV A材料的热导率与模型尺寸的关系。随着尺寸的增大,导热系数增大。导热系数随长度的增加近似线性增加,随宽度的增加呈非线性增加,表明导热系数与宽度的函数一阶导数随宽度的增加逐渐减小,但始终为正。总结了导热系数与温度的关系。导热系数随温度的升高而增大,导热系数相对于初始温度的一阶导数在330K左右达到最大值,但也有文献给出了相反的实验结果:导热系数随温度的升高而减小。本文所研究的二维IV A材料的分子动力学模拟过程及导热系数的影响因素在低维热物性研究领域具有一定的作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Research Progress on Thermal Conductivity of Two-dimensional IV A Materials Based on Molecular Dynamics Simulation
This paper introduces the research process of using molecular dynamics theory to simulate the thermal conductivity of two-dimensional IV A materials represented by graphene. The major works include using Materials Studio to construct the material model, importing the model into Lammps for simulation calculation, and using non-equilibrium molecular dynamics (NEMD) to calculate the thermal conductivity. The relationship between thermal conductivity and model size of several two-dimensional IV A materials is summarized. With the increase of size, the thermal conductivity increases. Moreover, the thermal conductivity increases approximately linearly with the increase of length and nonlinear with the increase of width, which shows that the first derivative of the function of thermal conductivity and width decreases gradually with the increase of width, but it is always positive. The relationship between thermal conductivity and temperature is summarized as well. The thermal conductivity increases with the increase of temperature, and the thermal conductivity has the maximum value with respect to the first derivative of the initial temperature around 330K, but some literatures have given the opposite experimental results: the thermal conductivity decreases with the increase of temperature. The molecular dynamics simulation process and influencing factors of thermal conductivity of two-dimensional IV A materials that are studied in this paper play a certain role in the field of low-dimensional thermal properties.
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