性能受限的openCL应用在CPU-GPU mpsoc上的可靠映射和分区

E. Wächter, G. Merrett, B. Al-Hashimi, A. Singh
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引用次数: 7

摘要

包含CPU和GPU内核的异构多处理器片上系统(mpsoc)通常需要同时执行应用程序。现有的方法利用在CPU和GPU内核中同时执行的应用程序,同时考虑到映射和分区的性能和能耗。本文提出了一种考虑系统温度行为的CPU-GPU mpsoc中应用程序映射和分区的建议。我们评估了温度分析来划分CPU和GPU之间的应用程序。在不同分区上执行不同的应用程序时,通过测量CPU和GPU内核的温度来完成性能分析。结果显示,在保持性能要求的同时,芯片的平均温度节省了13%。较低的热性能代表了SoC更好的长期可靠性(寿命)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reliable mapping and partitioning of performance-constrained openCL applications on CPU-GPU MPSoCs
Heterogeneous Multi-Processor Systems-on-Chips (MPSoCs) containing CPU and GPU cores are typically required to execute applications concurrently. Existing approaches exploit applications executing in CPU and GPU cores at the same time taking into account performance and energy consumption for mapping and partitioning. This paper presents a proposal for mapping and partitioning of applications in CPU-GPU MPSoCs taking into account the temperature behavior of the system. We evaluate the temperature profiling to partition the applications between CPU and GPU. The profiling is done by measuring the temperature of the CPU and GPU cores while executing different applications at different partitions. Results shown up to 13% savings of average temperature of the chip while maintaining performance requirements. A lower thermal behavior represents a better long-term reliability (lifetime) of the SoC.
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