Cu-Al-Mn形状记忆微线中与晶粒结构相关的非均匀弹性热效应

Bo Yuan, M. Qian, Xuexi Zhang, L. Geng
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引用次数: 0

摘要

利用红外热成像和电子背散射衍射相结合的技术,发现并研究了Cu-Al-Mn形状记忆微丝的非均匀弹性热效应。卸载后,在5毫米计长范围内检测到~5 K的可逆温度变化。通过红外热像仪测量,可以直接观察到微丝表面的温度分布不均匀。微线的不同区域(双晶、寡晶、单晶和多晶晶粒结构)表现出不同的eCE循环稳定性,这可归因于晶粒结构的异质性、晶粒取向的差异以及相邻晶粒约束的不同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Grain Structure Related Inhomogeneous Elastocaloric Effects in Cu-Al-Mn Shape Memory Microwires
An inhomogeneous elastocaloric effect (eCE) has been found and investigated in the present Cu-Al-Mn shape memory microwires by using combined technique of infrared thermography and electron backscatter diffraction. Upon unloading, a reversible temperature change of ~5 K has been detected within the 5 mm gauge length. Inhomogeneous temperature distribution can be directly observed on the surface of microwires through infrared thermography measurement. Different regions of the microwires, involving bi-crystalline, oligo-crystalline, single-crystalline and poly-crystalline grain architectures, display different eCE cyclic stability, which can be ascribed to the heterogeneous grain architectures, the discrepancy of grain orientation and the varied neighboring grain constraints.
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