通道长度为40nm的ZnO薄膜晶体管I-V特性仿真分析

Anchal Sharma, C. Madhu, Jatinder Singh
{"title":"通道长度为40nm的ZnO薄膜晶体管I-V特性仿真分析","authors":"Anchal Sharma, C. Madhu, Jatinder Singh","doi":"10.1109/ACCT.2015.23","DOIUrl":null,"url":null,"abstract":"For future low-priced electronics, high performance thin film transistors (TFTs) are highly desirable. One possible way towards device optimization is the downscaling of the channel length (L) which allows higher device density, smaller device configuration and better performance. In this paper, we present a simulation study of bottom gate TFTs based on ZnO as semiconductor, SiO2 as insulator layer and aluminum metal as drain/source contacts with channel lengths L from 50nm down to 30nm. The analysis is done using the two characteristic curves that is current/gate-voltage (ID-VG) curve and output characteristic (ID-VD) curve. The different parameters such as threshold voltage, on off current ratio and drive current are studied for different process parameters like gate oxide thickness, channel doping and channel width. To analyze that if the variation in parameters with downscaling is achievable, the simulated results are verified with theoretical results using mat lab.","PeriodicalId":351783,"journal":{"name":"2015 Fifth International Conference on Advanced Computing & Communication Technologies","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2015-02-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Simulation Based Analysis of I-V Characteristics of ZnO Thin Film Transistor at Channel Length 40nm\",\"authors\":\"Anchal Sharma, C. Madhu, Jatinder Singh\",\"doi\":\"10.1109/ACCT.2015.23\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"For future low-priced electronics, high performance thin film transistors (TFTs) are highly desirable. One possible way towards device optimization is the downscaling of the channel length (L) which allows higher device density, smaller device configuration and better performance. In this paper, we present a simulation study of bottom gate TFTs based on ZnO as semiconductor, SiO2 as insulator layer and aluminum metal as drain/source contacts with channel lengths L from 50nm down to 30nm. The analysis is done using the two characteristic curves that is current/gate-voltage (ID-VG) curve and output characteristic (ID-VD) curve. The different parameters such as threshold voltage, on off current ratio and drive current are studied for different process parameters like gate oxide thickness, channel doping and channel width. To analyze that if the variation in parameters with downscaling is achievable, the simulated results are verified with theoretical results using mat lab.\",\"PeriodicalId\":351783,\"journal\":{\"name\":\"2015 Fifth International Conference on Advanced Computing & Communication Technologies\",\"volume\":\"25 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2015-02-21\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2015 Fifth International Conference on Advanced Computing & Communication Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ACCT.2015.23\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2015 Fifth International Conference on Advanced Computing & Communication Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ACCT.2015.23","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

对于未来的低价电子产品,高性能薄膜晶体管(TFTs)是非常可取的。实现器件优化的一种可能方法是减小通道长度(L),从而实现更高的器件密度、更小的器件配置和更好的性能。在本文中,我们模拟研究了以ZnO为半导体,SiO2为绝缘层,铝为漏源触点的底栅TFTs,通道长度L从50nm到30nm。利用电流/门电压(ID-VG)曲线和输出特性(ID-VD)曲线进行分析。研究了栅极氧化物厚度、沟道掺杂和沟道宽度等不同工艺参数对阈值电压、通断电流比和驱动电流等参数的影响。为了分析参数随降尺度的变化是否可以实现,利用mat lab将模拟结果与理论结果进行了验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Simulation Based Analysis of I-V Characteristics of ZnO Thin Film Transistor at Channel Length 40nm
For future low-priced electronics, high performance thin film transistors (TFTs) are highly desirable. One possible way towards device optimization is the downscaling of the channel length (L) which allows higher device density, smaller device configuration and better performance. In this paper, we present a simulation study of bottom gate TFTs based on ZnO as semiconductor, SiO2 as insulator layer and aluminum metal as drain/source contacts with channel lengths L from 50nm down to 30nm. The analysis is done using the two characteristic curves that is current/gate-voltage (ID-VG) curve and output characteristic (ID-VD) curve. The different parameters such as threshold voltage, on off current ratio and drive current are studied for different process parameters like gate oxide thickness, channel doping and channel width. To analyze that if the variation in parameters with downscaling is achievable, the simulated results are verified with theoretical results using mat lab.
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