用于平面光波电路与激光二极管芯片的高精度快速粘接

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225) Pub Date : 1998-04-15 DOI:10.1109/IEMTIM.1998.704539

R. Sawada, H. Nakada, F. Ohira

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引用次数: 4

摘要

提出了一种精确、快速地连接平面光波导电路与激光二极管的新方法。该方法基于在PLC和激光二极管上制作的标记同时自动对焦。采用该方法构建的粘接设备精度在/spl plusmn/1 /spl mu/m以内。从真空镊子拾取激光二极管到完成粘合过程的周转时间为2又1/4分钟。

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Highly accurate and quick bonding for planar lightwave circuit and laser-diode chip

A new method for accurately and quickly bonding a planar light waveguide circuit (PLC) and a laser diode is proposed. The method is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the proposed method was accurate within /spl plusmn/1 /spl mu/m. The turnaround time, from picking up the laser diode with vacuum tweezers to completion of the bonding process, was 2 1/4 minutes.

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来源期刊

2nd 1998 IEMT/IMC Symposium (IEEE Cat. No.98EX225)

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