Study of the adhesion of a sintered Ag joint on a Cu substrate using laser shocks. Influence of aging

Silver pastes sintering is a potential candidate for die bonding in power electronic modules which are built by stacking up layers of various materials having different coefficients of thermal expansion. Consequently, in operating conditions, thermal stresses (tensile or compressive) develop at the interfaces between the layers. Moreover, during aging, the initial interface is expected to evolve, mostly due to diffusion of atomic species between adjacent layers. In this study, original laser-shock experiments, involving tensile stresses near the interface, are performed to investigate the influence of aging on the adhesive strength of sintered silver joints onto copper.