{"title":"扩展了SELA MC600微切割工具的输入样品接受度","authors":"H. Ahmataku, K. Kipli","doi":"10.1109/SMELEC.2010.5549535","DOIUrl":null,"url":null,"abstract":"Minimum input sample size and thickness for SELA MC600, a micro-cleaving tool, is 9 × 6 mm and 0.6 mm respectively. The machine will reject sample which is smaller or thinner than this acceptance value. But, in semiconductor Failure Analysis (FA) laboratories, it is inevitable to face such small and thin sample, for instance, a die from backgrinded wafer. Therefore, a technique named Dual-Edged Cleaving (DEC) is invented to circumvent this restriction.","PeriodicalId":308501,"journal":{"name":"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)","volume":"108 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-06-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"An extension of input sample acceptance for SELA MC600 micro-cleaving tool\",\"authors\":\"H. Ahmataku, K. Kipli\",\"doi\":\"10.1109/SMELEC.2010.5549535\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Minimum input sample size and thickness for SELA MC600, a micro-cleaving tool, is 9 × 6 mm and 0.6 mm respectively. The machine will reject sample which is smaller or thinner than this acceptance value. But, in semiconductor Failure Analysis (FA) laboratories, it is inevitable to face such small and thin sample, for instance, a die from backgrinded wafer. Therefore, a technique named Dual-Edged Cleaving (DEC) is invented to circumvent this restriction.\",\"PeriodicalId\":308501,\"journal\":{\"name\":\"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)\",\"volume\":\"108 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-06-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SMELEC.2010.5549535\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 IEEE International Conference on Semiconductor Electronics (ICSE2010)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMELEC.2010.5549535","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
An extension of input sample acceptance for SELA MC600 micro-cleaving tool
Minimum input sample size and thickness for SELA MC600, a micro-cleaving tool, is 9 × 6 mm and 0.6 mm respectively. The machine will reject sample which is smaller or thinner than this acceptance value. But, in semiconductor Failure Analysis (FA) laboratories, it is inevitable to face such small and thin sample, for instance, a die from backgrinded wafer. Therefore, a technique named Dual-Edged Cleaving (DEC) is invented to circumvent this restriction.
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