FEOL湿法清洁工艺良率提高的实例研究

R. Mitra, Zhiyong Xie
{"title":"FEOL湿法清洁工艺良率提高的实例研究","authors":"R. Mitra, Zhiyong Xie","doi":"10.1109/ASMC.2019.8791786","DOIUrl":null,"url":null,"abstract":"Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.","PeriodicalId":287541,"journal":{"name":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"A Case Study of Yield Improvement in a FEOL Wet Clean Process\",\"authors\":\"R. Mitra, Zhiyong Xie\",\"doi\":\"10.1109/ASMC.2019.8791786\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.\",\"PeriodicalId\":287541,\"journal\":{\"name\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2019.8791786\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 30th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2019.8791786","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

生产线末端的晶圆片显示产量损失。数据科学有助于在生产线前端(FEOL)的特定步骤序列中关联许多清洁工具/室。建立了多种模式和机制。本文报道了调查和实验结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A Case Study of Yield Improvement in a FEOL Wet Clean Process
Wafers at end-of-line showed yield loss. Data Science helped to correlate to numerous clean tools/chambers at a particular step sequence in Front End of Line (FEOL). Various models and mechanisms were established. The investigation and experiments conducted are reported in this paper.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信