HDGIM:不可靠的高尺度ffet的超维基因组序列匹配

H. E. Barkam, Sanggeon Yun, P. Genssler, Zhuowen Zou, Cheung Liu, H. Amrouch, M. Imani
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引用次数: 9

摘要

这是首次提出高尺寸(缩小到仅3nm)、多比特铁电场效应管(FeFET)技术的可靠应用。FeFET是一种新兴的技术,它不仅与现有的CMOS完全兼容,而且有望实现超高效和紧凑的内存计算(CiM)架构。然而,fefet与10nm厚度的铁电(FE)层斗争。这使得扩展变得非常困难,如果不是不可能的话,因为更薄的FE会显著缩小内存窗口,导致无法容忍的大错误概率。为了克服这些挑战,我们提出了HDGIM,这是一个在基因组序列匹配背景下迎合ffet的超维计算框架。众所周知,基因组序列匹配具有很高的计算成本,主要是由于巨大的数据移动,这基本上压倒了冯-诺伊曼架构。一方面,我们的跨层FeFET可靠性建模(从器件物理到电路)准确地捕获了FeFET缩放对由工艺变化和多位FeFET固有随机性引起的误差的影响。另一方面,我们的HDC学习框架通过使用两种模型进行迭代适应,一种是用于训练的全精度、理想模型,另一种是用于验证和推理的量化、噪声版本。我们的研究结果表明,在推理过程中,实现3位甚至4位的高尺度ffet可以承受任何给定高维的噪声。如果在模型调整过程中考虑噪声,相比于在匹配过程中加入噪声,可以提高固有的鲁棒性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
HDGIM: Hyperdimensional Genome Sequence Matching on Unreliable highly scaled FeFET
This is the first work to present a reliable application for highly scaled (down to merely 3nm), multi-bit Ferroelectric FET (FeFET) technology. FeFET is one of the up-and-coming emerging technologies that is not only fully compatible with the existing CMOS but does hold the promise to realize ultra-efficient and compact Compute-in-Memory (CiM) architectures. Nevertheless, FeFETs struggle with the 10nm thickness of the Ferroelectric (FE) layer. This makes scaling profoundly challenging if not impossible because thinner FE significantly shrinks the memory window leading to large error probabilities that cannot be tolerated. To overcome these challenges, we propose HDGIM, a hyperdimensional computing framework catered to FeFET in the context of genome sequence matching. Genome Sequence Matching is known to have high computational costs, primarily due to huge data movement that substantially overwhelms von-Neuman architectures. On the one hand, our cross-layer FeFET reliability modeling (starting from device physics to circuits) accurately captures the impact of FE scaling on errors induced by process variation and inherent stochasticity in multi-bit FeFETs. On the other hand, our HDC learning framework iteratively adapts by using two models, a full-precision, ideal model for training and a quantized, noisy version for validation and inference. Our results demonstrate that highly scaled FeFET realizing 3-bit and even 4-bit can withstand any noise given high dimensionality during inference. If we consider the noise during model adjustment, we can improve the inherent robustness compared to adding noise during the matching process.
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