{"title":"用于5GHz WLAN功率放大器的多层印刷电路板嵌入式无源","authors":"Chang-Lin Wei, Hung-Yen Liu, Chang-Sheng Chen, Cheng-Hua Tsai, Chin-Sun Shyu, Sinn-Juh Lay, Min-Lin Lee","doi":"10.1109/PORTABLE.2007.71","DOIUrl":null,"url":null,"abstract":"This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.","PeriodicalId":426585,"journal":{"name":"2007 IEEE International Conference on Portable Information Devices","volume":"23 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Embedded Passives On Multi-Layer Printed Circuit Board for 5GHz WLAN Power Amplifier\",\"authors\":\"Chang-Lin Wei, Hung-Yen Liu, Chang-Sheng Chen, Cheng-Hua Tsai, Chin-Sun Shyu, Sinn-Juh Lay, Min-Lin Lee\",\"doi\":\"10.1109/PORTABLE.2007.71\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.\",\"PeriodicalId\":426585,\"journal\":{\"name\":\"2007 IEEE International Conference on Portable Information Devices\",\"volume\":\"23 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2007-05-25\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2007 IEEE International Conference on Portable Information Devices\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/PORTABLE.2007.71\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 IEEE International Conference on Portable Information Devices","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/PORTABLE.2007.71","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Embedded Passives On Multi-Layer Printed Circuit Board for 5GHz WLAN Power Amplifier
This paper introduces the design and model for the basic embedded passives, and methods of circuits design with embedded elements for IEEE 802.11a on PWB lamination process. The power amplifier exhibits 26.4 dB of gain, 26 dBm of output PldB, and output IP3 of 37.2 dBm. Six layer stacks and three kinds of materials, such as Hi-DK material, low-loss material and commercial organic material were applied in this design. In this substrate, we use special high dielectric constant (DK>60 @ 1MHz) material to design embedded capacitors and use the new embedded resistors (Ik ohm/per square) for whole SiP module. The simulation and measured results have demonstrated a successful circuit design for 802.11a WLAN.
求助内容：
应助结果提醒方式：
京公网安备 11010802042870号
